果冻传媒

The rapid advancement in several data-centric technologies such as high-speed internet, IP-based high-speed services, ultra-high-definition multimedia streaming and gaming, AR/VR, etc., is leading to an exponentially rising demand for high-speed and continuously available internet access. This increasing demand has led to tremendous growth in data traffic that is growing by a factor of ten every five years. This data traffic growth demands a push toward high-performance connectivity for front-end and back-end network infrastructure. In this research area, we primarily focus on three sub-research themes:
 
Sub-research theme #1: Integration of electronics-photonics, packaging methodologies for IC integration
 
In this theme, we focus on the modeling of conventional packaging methodologies, such as wire-bonding and flip-chip, and novel packaging methodologies (through-polymer vias, waveguide packaging and integration), which can be used for integration in electronic-photonic and wireless systems. This research focus enables the development of co-design/co-optimization methods by incorporating these models in the design of electronic components in such systems.
 
Sub-research theme #2: Electro-optical/Photonic Transmitters
 
In this theme, we focus on developing driver amplifiers that drive the optical signal by directly modulating light from the Laser or via optical modulators, such as EAM or MZM for high-speed communication applications. The challenges addressed in this research focus include the design of these amplifiers concerning wide-bandwidth (> 100 GHz), linearity, low group-delay variation (< 10 ps), and high-energy efficiency. The activities in this theme also focus on novel system-level architectures, such as segmented electronic driver-optical modulator implementations to improve the energy efficiency, and enable high-speed communication up to Tbits/s.
 
Sub-research theme #3: Electro-optical/Photonic Receivers
 
In this theme, we focus on developing receiver amplifier chain in the electro-optical/photonic systems, which consists of developing transimpedance amplifiers, variable-gain, and main amplifiers. The challenges addressed in this theme include the amplifier design considerations concerning wide bandwidth (> 100 GHz), low group delay variation (< 10 ps), high dynamic range, and high energy-efficiency. The activities in this theme also focus on exploring architectures for an integrated photodiode-transimpedance amplifier array to improve the sensitivity and support high-speed communication that could be utilized in optical wireless communication applications, such as data center networks.
 
This research area has an overarching theme of IC technologies, such as CMOS, BiCMOS, CMOS SOI, and III-V, which are used to design electronic components. We also explore designs in different IC technologies related to work done in sub-research theme #1, where we explore packaging methods like heterogeneous integration. In this lab, we also collaborate with other research groups at the University, such as Photonic Integration (PhI), and Electro-Optical Communication (ECO), facilitating the development of integration of electronic-optical/photonic systems.